Polyfoam®C- Ultra Grip LJ
Application : Walls
Description
Polyfoam® C-UltraGrip is solid insulation board (panel) made from extruded polystyrene with a closed cell structure which has a surface fine structure. Products are delivered with the SE side edges (normal square).
Polyfoam® C-UltraGrip SE and LJ products are intended for thermal insulation of external walls of buildings - residential and commercial/industrial construction, thermal bridges, eventually for the internal thermal insulation of new buildings walls and reconstructed buildings as an external contact heat cladding systems. The structured surface increases the adhesion of glue, scraper and cement mortar adhesion to the board surface, therefore to do next technological steps should be more simple and easier.
Utilisation
External contact heat cladding systems 
Polyfoam® C-UltraGrip SE and LJ products are very suitable for making thermal insulation of external walls as a component of external contact heat cladding systems. These systems are used in new buildings or additional reconstructed buildings in regard to energy efficiency of constructions. With respect to the thermal bridges minimisation in gaps we recommend to apply exactly the Polyfoam® C-UltraGrip LJ product.
Installation - external contact heat cladding systems
- Assembly procedure for external contact heat cladding systems is specified by the producer – supplier of these systems incl. gluing technique and/or anchoring of the Polyfoam® boards (panels).
- During the gluing process and application of the insulation boards you can register better adhesion resulting from the structured surface.
| Thickness(mm) | Width (mm) | Lenght (mm) | m2/pack | λD (W.m-1.K-1) | RD (m2.K/W) |
| 30 | 600 | 1250 | 10,50 | 0,033 | 0,90 |
| 40 | 600 | 1250 | 7,50 | 0,033 | 1,20 |
| 50 | 600 | 1250 | 6,00 | 0,035 | 1,40 |
| 60 | 600 | 1250 | 5,25 | 0,035 | 1,70 |
| 80 | 600 | 1250 | 3,75 | 0,037 | 2,15 |
| 100 | 600 | 1250 | 3,00 | 0,035 | 2,85 |
| 120 | 600 | 1250 | 2,25 | 0,036 | 3,30 |
Advantages
- very low thermal conductivity coefficient - economic incentive of reduced heating costs is very significantly by reduced thermal loss through external walls
- high tensile strength vertically to the plane of board
- very low absorbability
- high dimensional stability in extreme temperature and moisture
- the structured surface increases a glue and cement mortar adhesion to the surface of board (panel), whereupon next works will be really easier
- Polyfoam® C-UltraGrip LJ product is furnished with a half-groove side edges, that can minimize thermal bridges and simplify installation
Diffusion resistance factor
- μ = 160–224 (UNI 9233-88)
Usage temperature
- –60 °C až +75 °C
Temperature expansion factor
- 0,07 mm/(m.K)
